Yield Engineering Systems (YES), a prominent supplier of semiconductor processing equipment, reported receiving a substantial order for its VertaCure™ G3 curing systems. The customer is a major foundry based in Asia.
The VertaCure™ G3 systems will be implemented in advanced packaging processes for artificial intelligence (AI) and high-performance computing (HPC) solutions. These systems provide low-temperature curing, annealing, and degassing capabilities.
YES President, Rezwan Lateef, emphasized the VertaCure™ family’s impact on high-volume manufacturing (HVM) of advanced packaging. He highlighted the VertaCure™ G3‘s ability to deliver superior mechanical, thermal, and electrical characteristics across various packaging types. The order, he stated, reinforces YES‘s position as a leader in curing equipment.
Alex Chow, YES‘ Senior Vice President of Sales and Business Development and Asia President, detailed the VertaCure™ G3‘s technical specifications. He noted its six-zone temperature control system and laminar flow, crucial for achieving uniform results in curing various materials. Chow also pointed out the system’s exceptional thermal uniformity, essential for processing thick films. He further stated that YES holds over 90% market share in advanced packaging curing chambers, with more than 500 VertaCure™ systems currently in use.
YES is a leading provider of materials and interface engineering technologies. Its clientele includes market leaders in advanced packaging for AI and HPC, memory systems, and life sciences. The company manufactures high-volume production equipment for semiconductor advanced packaging solutions. Their product portfolio includes vacuum cure, coat & anneal tools, and other equipment for the semiconductor industry. YES is headquartered in Fremont, California, and maintains a growing global presence.
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