Allonic lands record Hungarian pre-seed to industrialise robot-body manufacturing
Budapest-based robotics startup Allonic has raised €6 million ($7.2 million) in pre-seed funding to industrialise a manufacturing platform designed to produce complex, compliant robotic bodies with far less manual assembly. The company says the round is the largest pre-seed financing completed in Hungary to date.
The round was led by Visionaries Club, with participation from Day One Capital, Prototype, SDAC Ventures and TinyVC. More than a dozen angel investors also joined, including OpenAI and Hugging Face, alongside research institutions such as ETH Zurich and Northwestern University.
Shifting focus from software to the hardware bottleneck
Benedek Tasi, co-founder and CEO of Allonic, said robotics innovation is increasingly constrained by manufacturing limits rather than intelligence. “A lot of attention is on intelligence and software, but hardware still holds many of the hardest problems,” he said, pointing to long-standing trade-offs between durability and softness, and dexterity and strength.
What 3D Tissue Braiding aims to change
Founded in 2021, Allonic is developing 3D Tissue Braiding, a fully automated process that “weaves” bio-inspired robotic structures over a skeletal core. Instead of assembling hundreds of precision parts—bearings, screws, cables and delicate joints—the company forms tendons, joints and load-bearing soft tissues together in one continuous production run. It also aims to embed materials such as elastics, wiring and sensing elements directly during manufacturing.
The platform combines proprietary hardware and software to translate high-level designs into production instructions, similar to how 3D printing software “slices” a model into machine-readable steps. The company argues this could enable on-demand manufacturing of manipulators and end effectors, reducing downtime and making customised hardware economically viable.
Funding use and early traction
Allonic said it has completed a first pilot project in electronics manufacturing since revealing its technology in May 2025. The new capital will be used to accelerate product development, expand engineering and operations, and support additional pilots and early commercial deployments with industrial partners.
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